The main purpose of SMT assembly is to accurately place the components on the fixed position of the PCB circuit board. However, some process problems sometimes occur during the SMT assembly process, which affect the assembly quality, such as the displacement of components and the connection of the SMT assembly. Various process problems such as tin and solder leakage. Regardless of the cause, the problem needs attention.

The reasons for the displacement of components during SMT assembly can be found from the following aspects:

1. The use time of solder paste is limited. After the use period is exceeded, the flux in it will deteriorate and the soldering will be poor.

2. The viscosity of the solder paste itself is not enough, and the components oscillate and shake during handling, which causes the components to shift.

3. The flux content in the solder paste is too high, and the excessive flux flow during the reflow process causes the displacement of the components.

4. The components are displaced due to vibration or incorrect handling during the handling process after printing and assembly.

5. When the equipment is assembled, the air pressure of the suction nozzle is not adjusted properly, and the pressure is not enough, causing the components to shift.

6. The mechanical problem of the placement machine itself causes the placement of the components to be wrong.

Once the components are displaced in the SMT assembly, it will affect the performance of the circuit board. Therefore, in the process of processing, it is necessary to understand the reasons for the displacement of components and solve them in a targeted manner.