How do PCB Manufacturers Strengthen Material Management

(1) General requirements for materials management

A. Technical requirements for component procurement, provide ROHS training to procurement departments, and strengthen management of upstream suppliers.

B. Preparation. First of all, we must pay attention to whether the solder end material of the component is lead-free. If it is a lead-free component, we must figure out what the coating material is, especially BGA / CSP and new packaged devices such as QFN. Contents include coating materials on the surface of the solder end, maximum temperature and time resistance, and moisture sensitivity level

C. Identification and labeling. Lead-free components should be made lead-free identification and labeling.

D. Specify the lead-free component numbering method

E. Identification. Train production line operators to improve their ability to identify lead-free signs and labels.

F. Material management automation, you can manually scan the bar code label during the production process, or you can identify it by the RFID smart feeder on the placement machine, to achieve material management automation

G. Production line setup verification. In order to prevent the wrong components from being mounted on the placement machine, which will cause unnecessary losses, the production line setup should be verified by manual, semi-automatic or closed loop.

H.Traceability and bill of materials. Traceability requires a unique serial number for each assembly board, and then record all components and assembly process information on the pcb assembly board. It is easy to trace the source of the problem. This management is currently the most advanced method .

I. Storage of lead-free components and process materials. In terms of storage, companies can consider setting up separate warehouses for lead-free process materials, lead-free components, templates and tools for lead-free, or plan from existing warehouses. Provides considerable space for storage of lead-free materials, tools, etc.

J. Lead-free special tools. Must have tools such as lead-free special template, soldering iron or soldering station, tweezers, brushes, etc., and make logos.

K. Set up a dedicated station for lead-free manual soldering.

L. Strengthen electrostatic protection and management measures.

M. Take proper control measures for moisture sensitive devices (MSD).

(2) What the designer must mark on the BOM

A. The material of the inner lead of the component and the surface coating material of the soldering end;

B. the highest temperature resistance and the highest temperature resistance time;

C. Maximum heating and cooling slopes;

D. Tidal sensitivity level.

(3) Process personnel perform process control and design temperature curve according to design documents

For example, control of moisture-sensitive elements, Bi-containing elements, etc.

(4) Operators should implement according to the correct process method