Various PCB circuit board substrate material introduction

PCB circuit board various PCB substrate materials introduction, divided into: 94HB, fire board (94V0, FR-1, FR-2), half glass fiber (22F, CEM-1, CEM-3), full glass fiber (FR-4 ).

FR-1 features:

1.Halogen-free sheet is good for environmental protection

2.High anti-leakage electricity traces index (about 600 volts, special requirements are required)

3, suitable for punching temperature of 40 ~ 70 ℃

4, bow curvature, twist rate is small and stable

FR-2 features:

Excellent anti-leakage electricity traces (about 600v)

1. Low cost and wide application range

2.Excellent anti-moisture and heat resistance

3. Suitable punching temperature is 40 ~ 70 ℃ 8, bow curvature and twist rate are small and stable

4.Excellent dimensional stability

CEM-3 Features:

Excellent machinability, punchability R

1.The electrical performance is equivalent to FR-4, the processing technology is the same as FR-4, and the wear rate of the drill is smaller than that of FR-4.

2.Multi-level anti-leakage electricity traces (CTI 175V, CTI300V, CTI 600V)

3. Meet the requirements of IPC-4101A

FR-4 features: halogen-free, bromine and chlorine element content less than 0.09%

1, does not contain brocade and red phosphorus, no toxic components remain during burning, and the sheet is harder than KB-6160

The following are the product models: Paper-clad copper panel KB-3152 FR-1

It is an environmentally-friendly halogen-free and brocade-free copper-based phenolic resin copper laminated board developed for environmental protection. It can avoid the toxic substances and gases generated when the board contains halogen and brocade. It has a high leakage electricity index (about 600 volts) and is suitable for low temperature punching operations.

КB-3151S FR-1 is a paper-based phenolic resin copper area laminate developed for the needs of precision circuit boards such as high-density automatic plug-ins and chip component surface adhesion technology. Has excellent resistance to silver migration and electrical properties in humid environments.

КB-3150 / KB-3151 is a paper-based phenolic resin copper area laminate newly developed to meet the needs of precision circuit boards such as high-density automatic plug-ins and chip surface adhesion technology. It can have a high leakage index (about 600 volts) and is suitable for low temperature punching operations.

KB-3150 FR-1 is a paper-based phenolic resin edge laminated board developed for precision components such as switch boxes (keyboard switches, push switches). It has excellent flame retardancy and dimensional stability, and is suitable for low temperature punching operations.

KB-2151 FR-2 is a paper-based phenolic resin copper area laminate developed for the needs of precision circuit boards such as high-density automatic plug-ins and wafer component surface adhesion technology.

KB-2150G / 2150GC FR-2 is an environmentally friendly halogen-free, brocade-free paper-based phenolic resin copper area laminate developed for environmental protection. It not only maintains the good performance of FR-2, but also has excellent anti-humidity and heat resistance.

KB-150 / 1150 / 150D Unclad (ANSI: XPC) is a paper-based phenolic resin laminated board developed for the needs of precision components for mechanical transmission. Has good humidity and heat resistance, and is suitable for low temperature punching operations. KB-1150 / KB-1151 ANSI XPC is a paper-based phenolic resin copper laminate, which has good anti-moisture and heat resistance, and is suitable for low temperature punching operations.

The following are the product models: Glass fiber copper-clad panel prepreg FR-4 is obtained by curing the flame retardant epoxy resin impregnated Japanese-grade glass cloth to the "B" stage under precise temperature and weight control, making Laminated circuit boards have stable rheological properties during the manufacturing process.

KB-7150 CEM-3 is a composite base copper-clad board that can replace FR-4 for single / double-sided circuit boards. It has good processability, metallized hole reliability, and anti-humidity and heat resistance.

KB-6167 FR-4 is an epoxy glass cloth-based copper-clad laminate, which has excellent heat resistance and mechanical properties. It can be used for printed wiring boards requiring high density and excellent heat resistance.

KB-6165 FR-4 is used in computers and peripheral equipment, communication equipment, instrumentation, office automation equipment, etc. Light blocking function, suitable for making printed circuit boards with UV blocking and AOI functions.

KB-6162 FR-4 is an environmentally-friendly glass fiber cloth / epoxy resin-based copper-clad laminate that does not contain toxic components such as halogen, paving, red phosphorus, etc, apply for computers, computer peripherals, cameras, etc.

KB-6160 / 6160C FR-4 is an epoxy glass cloth-based copper-clad laminate with ultraviolet blocking function. Other properties are equivalent to KB-6150. It is suitable for two-way simultaneous photosensitive curing solder resist ink (UV) and optical automatic inspection (AOI) circuit board. KB-6150 / 6160 FR-4 is used in computers, testing equipment, video recorders, televisions, military equipment, guidance systems, etc.