1. Pasting process The pasting process is located at the forefront of the SMT production line. Its function is to apply the solder paste on the pads of the SMT circuit board to prepare for the mounting and soldering of the components.

2. Mount the surface mount components to the fixed position of the SMT circuit board accurately.

3. The role of curing is to melt the patch glue, so that the surface mount components and the circuit board are firmly bonded together.

4. The function of reflow soldering is to melt the solder paste, so that the surface mount components and the PCB board are firmly bonded together.

5. The function of cleaning is to remove the solder residues (such as flux, etc.) harmful to the human body on the assembled circuit board.

6. Inspection Its function is to inspect the welding quality and assembly quality of the assembled circuit board.

7. The function of rework is to rework the circuit board that has been detected to be faulty.

Double-sided SMT+THT mixed assembly (double-sided reflow soldering, wave soldering) process

A surface coating paste-component placement-reflow soldering-flip board-B side red glue-component placement-glue curing-flip board-A side plug-in-pin bending ——Wave soldering——Cleaning——Inspection——Rework Double-sided hybrid assembly PCB board has conductive layers on both sides (ie double-sided board), and the chip integrated circuit is installed on the A side of the PCB board. The pin spacing is small, or the pins are integrated The SMT components at the bottom of the circuit are soldered by reflow, and then THT components are mixed and inserted. The SMT components with a large pin spacing and moderate weight on the B side are often wave soldered. However, with the improvement of reflow soldering technology, reflow soldering is now also useful. In order to reduce the damage to the solder joints of the A side that has been soldered during reflow soldering, the B side must use low temperature and low melting point solder paste.

This mixed assembly process is suitable for PCB boards with high component density, components must be arranged on the bottom surface and more THT components. It can not only improve processing efficiency but also reduce manual welding workload.