The through-hole to SMT conversion provides many benefits, including reduced costs and smaller and faster circuit boards.

Surface mount technology (SMT) is used almost exclusively by PCB components, and for good reasons. SMT is a fast, fully automated process that can improve the accuracy of component placement, reduce manual labor, provide consistent quality and reduce costs. Converting an existing through-hole technology design to SMT is a fairly cheap process and can save you a lot of money in the long run. To successfully adapt through-hole circuit boards to SMT, you need to choose a company with electrical engineering expertise and comprehensive knowledge of SMT processes.

What are the advantages of through-hole to SMT conversion?

Surface mount components (commonly referred to as SMD-surface mount devices) are smaller and lighter than through-hole components. This allows for lightweight boards and higher density components.

SMT does not need to pre-drill the board, thereby reducing the time and cost of manufacturing. The process is also fully automated and can quickly produce accurate and repeatable circuit boards, thereby further reducing costs.

Since the component leads cannot pass through the circuit board, the components can be mounted on both sides of the circuit board. This opens up more design possibilities, and more functions can be packaged into the same circuit board area.

Manufacturers stopped using many through-hole components, and most advanced components are not compatible with through-hole mounting. SMDs are also generally cheaper than through-hole products.

Automatic assembly can improve placement reliability and reduce errors. It also allows more thorough and accurate testing of the circuit board.

What is involved in the through-hole conversion of SMT?

When evaluating products for conversion, we will identify all potential issues that may affect the circuit board, such as:

1. The end use of the product (especially temperature and temperature cycle)

2. Mechanical constraints (form factor, vibration, etc.)

3. Component voltage, current and rated power

4. Component availability

5. Programming and testability issues