With the rapid development of SMT technology, SMT processing gradually replaced DIP assembly. However, due to the large size of some electronic components in PCBA production, DIP assembly has not been replaced, and it still plays an important role in the electronic assembly process. DIP assembly is after SMT patch processing, generally using assembly line manual plug-in, which requires a lot of employees.

The process flow of DIP assembly can generally be divided into: component forming process → plug-in → wave soldering → component cutting foot → repair welding (post welding) → washing board → function test.

1. Pre-process the components. First of all, the staff of the pre-processing workshop collect the materials from the material place according to the BOM material list, carefully check the material model, specification, sign, and perform pre-production pre-processing according to the sample, using automatic bulk capacitor clipper, transistor automatic molding machine, and fully automatic Belt molding machine and other molding equipment for processing.

2. Plug-in, insert the processed components of the patch to the corresponding position of the PCB board to prepare for wave soldering.

3. Wave soldering, put the plug-in PCB board into the wave soldering conveyor belt, and complete the soldering of the PCB board after flux spraying, preheating, wave soldering, cooling and other links.

4. Cut the foot of the component and cut the foot of the soldered PCBA board to achieve the appropriate size.

5. Repair welding (post-welding), repair welding and repairing the PCBA finished board that is not completely welded.

6. Wash the board, and clean the flux and other harmful substances remaining on the PCBA finished product to meet the environmental protection standard cleanliness required by the customer.

7. Functional test. After the components are welded, the finished PCBA board should be tested for function to test whether each function is normal. If a functional defect is found, it should be repaired and then tested.

The above is the introduction of the DIP assembly process flow shared by FASTPCBA.

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