During turnkey pcb manufacturing process,affecting factors of raw materials

During turnkey pcb manufacturing process, the impact on product quality is not only the elements of manual operation, but also the elements of raw materials, and the latter have great impact on the inner layer short circuit. Because of its high dimensional stability, it determines the accuracy of the inner layer positioning and the quality of the product, so we should pay attention to the original data.

The stability of the multi-layer PCB data scale is the primary factor affecting the accuracy of the inner layer positioning. It is also necessary to consider the influence of the thermal expansion coefficient of the substrate and the copper foil on the inner layer of the multilayer PCB. From the analysis of the physical properties of the substrate used, the laminate turnkey pcb boards contains a polymer which changes its main structure at a certain temperature, collectively referred to as the glass transition temperature Tg. The glass transition temperature is a unique feature of the large number of polymers, second only to the coefficient of thermal expansion, which is the most important property of the laminate board.

The plated through holes are less natural than the surrounding laminate board. Since the laminate board is thermally expanded faster than the hole during turnkey pcb manufacturing process, this means that the through-hole body is stretched in the direction in which the laminate turnkey pcb manufacturing board is deformed. This stress condition causes tensile stress in the through-hole body. When the temperature rises, the tensile stress will continue to increase. When the stress exceeds the cracking strength of the through-hole plating, the plating layer will crack. At the same time, the higher thermal expansion rate of the laminate board causes the stress on the inner conductor and the welding pad to increase significantly, causing the conductor to crack with the pad and forming a short circuit in the inner layer of the multilayer turnkey pcb manufacturing.

In the process of turnkey pcb manufacturing, the selection of the original data is also very important. We need to conduct a deep analysis of the functions of the raw materials to ensure that the raw materials reach certain technical requirements, so as to help the later processing. Future technologies will continue to evolve, and its production methods will become more advanced over time, ensuring that the scale and accuracy of the turnkey pcb manufacturing meets the requirements.