FPCB sheet material with high heat resistance and high stability performance
date：2018-11-05 15:53:00
FPCB sheet material with high heat resistance and high stability performance
In terms of the final shape of chemical materials, PI can be used as a gasket, a gasket, and a sealing material. The bismale material can be used in the substrate of a soft multilayer circuit board, a wholly aromatic material, and organic in use. Among the polymer materials, it has the highest heat resistance, and the heat resistance temperature can reach 250~360°C! As for the bismale type PI used as a flexible circuit board, the heat resistance characteristics are slightly lower than the total aromatic PI, and it is generally above and below 200 °C.
The bismale type PI has excellent performance in mechanical materials, is extremely low in temperature change, and can maintain a high stability state in a high temperature environment, minimal creep deformation, and low thermal expansion rate! In the temperature range of -200~+250 °C, the amount of change of the material is small, and the bismale type PI has excellent chemical resistance. If it is impregnated with 5% hydrochloric acid at 99 ° C, the tensile strength retention rate of the material is maintained. Can still maintain a certain degree of performance. In addition, the frictional wear characteristics of the bismale type PI are also extremely superior, and it can also have a certain degree of wear resistance for applications that are prone to wear.
In addition to the main material properties, the structural composition of the FPCB substrate is also a key. The FPCB is a cover film (upper layer) as an insulating and protective material, with an insulating substrate, a rolled copper foil, and an adhesive to form an integral FPCB. The substrate material of FPCB has insulating properties. Generally, polyester (PET) and polyamidamine (PI) are commonly used. PET or PI have their advantages/disadvantages.
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