HDI requires high density for the line. Laser is required for opening.
date：2018-11-06 18:05:00
HDI requires high density for the line. Laser is required for opening.
In fact, the HDI high-density method is not clearly defined, but the difference between HDI and non-HDI is actually quite large. First, the hole diameter of the circuit board made by HDI needs to be less than or equal to 6 mil (1/1,000 吋). As for the ring diameter of the hole ring, it needs ≦10 mil, and the layout density of the line contact point needs to be more than 130 points per square inch, and the line spacing of the signal line needs to be less than 3 mil.
The advantages of HDI printed circuit boards are quite large. Because HDI is highly integrated, the area of the board can be greatly reduced. The higher the number of layers, the smaller the board surface can be increased. Due to the smaller substrate size, HDI applications The board surface area can be 2~3 times less than the non-HDI board design, but the same complex circuit can be maintained, and the material weight of the natural board can be reduced. As for the specific block circuit design for radio frequency, high frequency, etc., the multi-layer structure can be well utilized, and a large-area metal ground layer is disposed in the upper/lower layer circuit of the main circuit, which limits the high-frequency line EMI problem that may be caused by the PCB. HDI inside the board, to avoid affecting the operation of other external electronic equipment.
The HDI sheet is lighter in weight and has higher line density. The space utilization rate in the casing is higher than that of the non-HDI circuit board design, and the original high-frequency operation device will make the transmission distance of the signal line after adopting HDI. Shortening, naturally, the signal transmission quality of the new SoC or high-frequency operation device is better due to better electrical characteristics, and the transmission performance is improved. In addition, if HDI uses more than 8 layers, it can basically obtain better than non-HDI circuit board. Cost-effective, this can also be used in the design of the terminal product, HDI motherboard design, improve product performance and specification data performance, so that products are more competitive in the market.
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