At present, when the pcb board continues to work at a high temperature above 240℃ for more than 30 minutes, or at a high temperature of 150℃-240℃ for more than 30 minutes, it will greatly affect the electrical performance of the PCB board. For this reason, a high-temperature-resistant pcb board and a manufacturing method thereof are proposed, which can make the pcb board continue to work in a high-temperature environment and ensure its electrical reliability.

The high temperature resistant PCB board according to the embodiment of the first aspect includes:

The substrate layer is made of high temperature resistant materials;

Two bottom copper layers are used to generate line conductors, and the two bottom copper layers are respectively laminated and arranged on both sides of the substrate layer;

Two copper-plated layers are used to increase the thickness of the line conductor and generate a conductor in the hole, and the two copper-plated layers are respectively stacked on the sides of the two bottom copper layers;

Two layers of chemical gold are used to immerse the surface of the line conductor and the conductor in the hole with full-board gold, and the two chemical gold layers are stacked on the sides of the two copper plating layers;

Two-layer covering films are made of high-temperature-resistant solder mask materials, and the two covering films are laminated and arranged on the sides of the two chemical gold layers;

Two electro-gold layers, the two electro-gold layers respectively cover the gold finger parts arranged on the sides of the two covering films.

The high-temperature-resistant PCB board according to the embodiment has at least the following beneficial effects: firstly, the substrate layer is made of high-temperature resistant materials, which can ensure that the PCB board can work stably for a long time in a high-temperature working environment above 240℃; secondly, the copper plating layer It can thicken the thickness of the line conductor and generate the conductor in the hole, which greatly increases the reliability and conductivity; in addition, the chemical gold layer can prevent the line conductor and the conductor in the hole from oxidizing in the high temperature working environment; in addition, the covering film is made of resistant Made of high-temperature solder mask material, it can ensure that the pcb board can work stably for a long time in a high-temperature working environment above 240 ℃; finally, the electro-gold layer can increase the number of times of plugging and unplugging of the gold finger and enhance the ability of anti-wear.

According to some embodiments, the thickness of the substrate layer is 0.254 mm.

According to some embodiments, the thickness of the bottom copper layer is 0.015 mm.

According to some embodiments, the thickness of the copper plating layer is 0.020 mm.

According to some embodiments, the thickness of the chemical gold layer is 0.005 mm.

According to some embodiments, the thickness of the cover film is 0.075 mm.

According to some embodiments, the thickness of the electro-gold layer is 0.001 mm.

The method for manufacturing a high temperature resistant PCB according to the embodiment of the second aspect includes the following steps:

Cover the bottom copper layers for generating line conductors on both sides of the base material layer made of high temperature resistant materials;

Covering the side surface of the bottom copper layer with a copper plating layer for increasing the thickness of the line conductor and generating the conductor in the hole;

A chemical gold layer for immersing the surface of the line conductor and the conductor in the hole is covered on the side of the copper plating layer;

Press-fit a cover film made of a high-temperature-resistant solder mask material on the side of the chemical gold layer, the pressing melting temperature during pressing is 310°C, and the pressure is 350 psi;

An electro-gold layer is provided on the gold finger part on the side surface of the covering film.