The pores produced by PCBA board soldering, which is what we often call bubbles, are generally caused by reflow soldering and wave soldering during PCBA processing. So how to improve the problem of PCBA board soldering pores? PCBA manufacturer FASTPCBA will explain it in detail for you.

1. Bake

Bake PCBs and components that have been exposed to the air for a long time to prevent moisture.

2. Control of solder paste

The solder paste contains moisture and is prone to pores and tin beads. First select a good quality solder paste. The temperature recovery and stirring of the solder paste are strictly performed according to the operation. The time that the solder paste is exposed to the air is as short as possible. After the solder paste is printed, reflow soldering needs to be carried out in time.

3. Workshop humidity control

Monitor the humidity in the workshop in a planned way, and control it between 40-60%.

4. Set a reasonable furnace temperature curve

Test the furnace temperature twice a day, optimize the furnace temperature curve, and the heating rate should not be too fast.

5. Flux spraying

During wave soldering, the spraying amount of flux should not be too much, and the spraying should be reasonable.

6. Optimize furnace temperature curve

The temperature of the preheating zone needs to meet the requirements, not too low, so that the flux can be fully volatilized, and the speed of passing the furnace is not

There may be many factors that affect PCBA soldering bubbles, which can be analyzed from the aspects of PCB design, PCB humidity, furnace temperature, flux (spray size), chain speed, tin wave height, solder composition, etc. It needs to be debugged many times. May come to a better way.