In SMT circuit board assembly,five major development trends in PCB technology

In the 21st century, human beings have entered a highly information society. In the information industry, SMT circuit board assembly an indispensable pillar .

Electronic equipment requires high performance, high speed and light and thin, and as a multidisciplinary industry - PCB is the most critical technology for high-end electronic equipment. PCB products, whether rigid, flexible, rigid-flex bonded multi-layer boards, and module substrates for IC package substrates, have made great contributions to high-end electronic devices. SMT circuit board assembly plays an important role in electronic interconnect technology.

Recalling the difficult journey of China's PCB in the past 50 years, today it has written a glorious page in the history of PCB development in the world. In 2006, China's PCB production value was nearly 13 billion US dollars, known as the world's largest SMT circuit board assembly country.

As for the current development trend of PCB technology, I have the following points:

First, along the road of high-density interconnect technology (HDI)

Since HDI concentrates on the most advanced technology of contemporary PCBs, it brings fine wire and micro-aperture to the PCB. HDI multi-layer board application terminal electronic products - mobile phone (mobile phone) is a model of HDI frontier development technology. In the mobile phone, the micro-wires of the PCB main board (50μm to 75μm/50μm to 75μm, wire width/pitch) have become mainstream,in addition,the conductive layer and the board thickness are thinned; the conductive pattern is refined, which brings high density and high performance of electronic equipment.

For more than 20 years, HDI has promoted the development of mobile phones, and the development of LSI and CSP chips (packages) for packaging and controlling basic frequency functions, and the development of stencil substrates for packaging have also promoted the development of SMT circuit board assembly. Therefore, it is necessary to follow the road of HDI.

Second, the component embedded technology has a strong vitality

The formation of semiconductor devices (called active components), electronic components (called passive components) or passive component functions in the inner layer of the PCB has been mass-produced. Component embedding technology is a huge change in PCB functional integrated circuits, but to develop must solve the analog design method, production technology and inspection quality, reliability assurance is a top priority.

We need to invest more resources in systems including design, equipment, testing, and simulation to maintain a strong vitality.

Third, the development of materials in the PCB should be further improved.

Whether it is a rigid PCB or a flexible PCB material, as global electronic products are lead-free, it is required to make these materials more resistant to heat. Therefore, the new high Tg, small thermal expansion coefficient, small dielectric constant, and excellent materials with dielectric loss angle tangent keep emerging.

Fourth, the prospect of photovoltaic PCB is broad

It uses the optical path layer and the circuit layer to transmit signals. The key to this new technology is the fabrication of optical path layers (optical waveguide layers). It is an organic polymer formed by lithographic photolithography, laser ablation, reactive ion etching, and etc. At present, the technology has been industrialized in Japan, the United States, and etc.

Fifth, the manufacturing craft should be updated, and advanced equipment should be introduced.

1.Manufacturing craft

HDI manufacturing has matured and improved. With the development of PCB technology, although the conventional methods of manufacturing subtractive methods still dominate, the low-cost craft such as additive and semi-additive methods have begun to emerge.

A new manufacturing craft of flexible PCB by using nano technology to metallize holes and form PCB conductive pattern.

High reliability, high quality printing method, inkjet PCB craft.

2. Advanced equipment

Production of fine wires, new high-resolution photomasks and exposure devices, and laser direct exposure devices.

Uniform plating equipment.

Production components are embedded (passive and active components) manufacturing and installation equipment and facilities.