Mobile phone circuit boards

The layout requirements of mobile phone circuit boards are mainly as follows:

1. Spacing requirements In order to ensure that the component spacing on the PCB can meet the SMT mass production capacity of our company, the distance between components (edge to edge) ≥ 6mil.

2, structural design requires the layout of components to fully consider the requirements of structural design, in the PCB design, to fully communicate with the structural engineer, under the premise of ensuring electrical characteristics, should be placed in different areas according to structural design requirements Components of different heights and sizes.

3, electrical characteristics require the placement of components to meet the requirements of electrical characteristics, the RF part of the device can not be placed in the baseband part, the baseband part of the components can not be placed in the RF part, according to the schematic, the distribution of different electrical characteristics of the components In different areas, in order to prevent crosstalk, the parts are separated by a shield if necessary. In addition, referring to the schematic diagram, adjacent devices in the schematic are also placed adjacently (for example, the filter capacitor of the signal line on the I/O should be Place it on the corresponding PIN pin of the I/O connector, otherwise it will not be filtered. The higher the frequency, the smaller the capacitance and the closer the distance is.