Modern electric circuit board components packaging development

The electric circuit board products are developing towards portable, miniaturized, networked and multimedia. This market demand puts forward corresponding requirements for circuit assembly technology. The increase of unit volume storage information and the improvement of unit time processing speed become an important promotion factor in the development of micro electronic packaging technology.

There are many types of leads and mounting types for integrated circuit packages. They can be divided into through-hole plug-in type and surface mount type according to the way of mounting to printed circuit boards. The current electronic package mainly adopts surface mount method, and the way of through-hole insertion has been rarely used, only for individual parts. Since the development of semiconductor components, the packaging technology of electric circuit board components has been innovated every day. It has undergone four major technological changes. The first technological change was the dual in-line pin package of the mid-1970s. (DIP): The second is the pin flat package (QFP) of the 1980s; then the chip-based package (CSP), flip chip package (FC), and ball grid array package in the 1990s. (BGA) represents the packaging technology; the fourth technological change occurred in the early 21st century, with Wafer-level packaging (WLP), system packaging (SIP), chip thinning, package-on-package (Package on Package) , POP) and Wafer-Level-Processed Stacked Package (WSP) and other representative packaging technologies. Especially in the development of embedded devices after 2010, coupled with the large demand for mobile electronic products, promoted the miniaturization and integration of chip packaging.

In the future, the development direction of integrated circuit electric circuit board packaging is mainly based on CSP, MCM and 3D packaging.