The traditional PCBA cleaning process will have a destructive effect on the environment, and PCBA no-clean soldering technology is the best way to solve this problem. PCBA no-clean soldering includes two techniques. One is to use a low-solid no-clean flux. The other is welding inert shielding gas. For the first method, the activity of the flux is only effective for a certain period of time, and the obtained weld cannot be ensured. Sometimes it causes welding defects such as bridging, tilt and spotting, which limits its application areas and requires further the study. development of. For the second method, welding is performed in an inert gas, which eliminates the environment where the welding part is oxidized during the welding process, thereby reducing or eliminating the use of flux. Before welding, only a small amount of weakly active flux can be used to remove oxides on the surface of the welded parts and maintain an inert gas atmosphere, or the leads of the parts can be processed to achieve surface welding.

The surface welding process is not only suitable for through-hole assembly, mixed assembly and full-surface assembly parts, but also for the assembly of multi-lead fine-pitch parts. The following advantages are shown in these applications.

1. Used in the double wave soldering process, due to less or less use of flux, soldering defects caused by flux gas are eliminated, nozzle clogging is eliminated, the stability of wave soldering is improved, and the high quality is convenient. Welding connection.

2. Eliminates the need for cleaning process and corresponding equipment, greatly reducing operating costs.

3. As the solder and the soldered part are oxidized, the wettability of the solder and the solderability of the soldered part are improved, thereby minimizing soldering defects, greatly improving the soldering quality, and ensuring the reliability of the soldering of the components.

Therefore, PCBA no-clean welding technology is a very valuable practical technology, and FASTPCBA has always applied this no-clean process in PCBA processing. Its popularization and application have very important practical significance in terms of technology cost and protection of human living environment.