Pcb factory quick turn pcb smt results analysis

The analysis of the mounting results of the pcb factory quick turn pcb is a quality requirement for the smt products, and generally should follow the IPC related acceptance criteria. Products are classified according to three categories: consumer electronics, industrial electronics, military and aerospace. The criteria for acceptance are different for different categories. Taking offset defects as an example, for consumer electronics, the area of the soldering end or the pin portion falling on the pad is 50%, which can meet the first-level acceptance criteria, and less than 50% is unqualified; for industrial electronics products, solder joints or pin parts falling on the pad area between 50% and 75%, meet the second acceptance criteria, if more than 75% is better; for military and aerospace products, the area of the solder pcb or pin portion of the pcb factory turn pcb that falls on the pad exceeds 75%, meeting the three-level acceptance criteria.

Smt components offset

A. Smt components offset occurs across the substrate

B. Smt components offset occurs only in a part of the substrate

C. Smt components offset occurs only for specific components

2. The entire substrate smt components ares not neat

3. Mounting angle offset

4. Component suction error

5. Laser recognition error

6. Nozzle loading and unloading error

7. Mark (BOC mark, IC mark) recognition error

8. Image recognition error

9. SMT machine throwing material