PCB manufacturing reflow soldering furnace technical indicators and development direction

1.The main technical indicators of PCB reflow furnace are temperature control accuracy, lateral temperature difference of conveyor belt, maximum heating temperature, number and length of heating zones, conveyor belt width, cooling efficiency, etc.

① Temperature control accuracy: should reach + 0.1 ~ 0.2 ℃.

②Transverse belt lateral temperature difference: traditional requirements are below ± 5 ℃, lead-free soldering is required below± 2 ℃.

③Temperature curve test function: If the equipment does not have this configuration, you should purchase a temperature curve collector.

④ Maximum heating temperature: Lead-free solder or metal substrate, should choose 350 ~ 400 ℃.

⑥ Number and length of heating zones: The longer the heating zone length and the greater the number of heating zones, the easier it is to adjust and control the PCB manufacturing temperature curve. For lead-free soldering, you should choose more than 7 temperature zones.

⑥ Conveyor width: It should be determined according to the maximum and minimum PCB size.

⑦ Cooling efficiency: It should be determined according to the complexity and reliability requirements of the product.For products with complex and high reliability requirements, high cooling efficiency should be selected.

2. PCB manufacturing reflow furnace development direction

Reflow welding equipment is developing in the direction of high efficiency, multifunctionality and intelligence. Among them are reflow welding furnaces with unique multi-jet airflow control, reflow welding furnaces with nitrogen protection, and reflow welding with local forced cooling furnaces, reflow furnaces that can monitor component temperature, reflow furnaces with dual conveyors, reflow furnaces with center support, etc. With the development of lead-free, gas-phase reflow welding has resurrected, and based on the traditional gas-phase welding equipment, a jet-reflow-based welding furnace has been developed.