PCB lamination is a very important process for the production of circuit boards. Many small and medium-sized enterprises can only make simple single-layer and double-layer boards. Once it involves multi-layer complex boards, they can't do it. This is not only because of the technical problems of the production personnel, but also mainly because of the machinery and equipment.

How is the multilayer board pressed when making the pcb board?

1. Pressure cooker

This is a container that is filled with high-temperature saturated water vapor and can be applied with high air pressure. When making a pcb board, the laminated substrate sample can be placed in it for a period of time to force the water vapor into the board and then take it out The sample is then placed on the surface of high-temperature molten tin, and its "delamination resistance" characteristics are measured.

2. Cap pressing law

It refers to the traditional lamination method of early PCB multilayer board production. At that time, the "outer layer" mostly used single-sided copper thin substrates for stacking and pressing. It was not until the increase in output that the current copper skin type was used. The large or large amount of pressure is legal.

3. Folds

In multi-layer board pressing, it often refers to the wrinkles that occur when the copper skin is improperly handled.

4. Depression

Refers to the gentle and uniform sag on the copper surface during the production of the pcb board, which may be caused by the partial protrusion of the steel plate used for pressing. If these shortcomings are unfortunately left on the line after the copper is etched, it will cause high-speed transmission signals. The impedance is unstable, and the pcb board will appear noise.

5. Copper foil pressing method

Refers to the mass-produced PCB multilayer board, the outer layer of copper foil and film are directly pressed with the inner layer, which becomes the large-scale pressing method of multiple rows of multilayer boards to replace the traditional pressing method of single-sided thin substrates in the early days.