PCB production process

First, contact the manufacturer first need to contact the manufacturer, and then register the customer number, then someone will quote for you, place an order, and follow up the production progress. Second, the purpose of the material: according to the requirements of the project data MI, on the large sheet of the required sheet, cut into small pieces of production board. Small pieces of sheet that meet customer requirements. Process: large sheet material → cutting board according to MI requirements → slab board → beer round corners • edging edge → stripping board 3. Drilling purpose: According to the engineering data, the corresponding position is drilled on the sheet material that meets the required size. Find the aperture. Process: stacking pin → upper plate → drilling → lower plate → inspection \ repair four, copper sinking purposes: copper is a chemical method to deposit a thin layer of copper on the insulating hole wall. Process: coarse grinding→hanging board→sinking copper automatic line→lower board→immersion% thin H2SO4→thickening copper five, graphic transfer purpose: graphic transfer is to transfer the image on the film to the board process: (blue oil process): grinding Plate→Printing the first side→Drying→Printing the second side→Drying→Explosion→Shadowing→Checking; (Dry film process): Main board→Laminating→Stilling→Alignment→Exposure→Stilling→Shadowing →Inspection 6. Graphic plating purpose: Graphic plating is to deposit a layer of copper with a required thickness and a thickness of gold or tin on the exposed copper skin or hole wall. Process: upper plate → degreasing → water washing twice → micro-etching → water washing → pickling → copper plating → water washing → pickling → tin plating → water washing → lower plate seven,

film removal purpose: use NaOH solution to remove the anti-electroplating coating layer Make the non-line copper layer bare. Process: water film: inserting → soaking alkali → washing → scrubbing → passing machine; dry film: placing board → passing machine eight, etching purpose: etching is to use chemical reaction method to corrode the copper layer of non-line parts. Nine, green oil purpose: Green oil is the transfer of the pattern of green oil film to the board, to protect the line and prevent the solder on the line when the action of tin on the line: grinding plate → printing photosensitive green oil → seesaw → exposure → rush Shadow; grinding board → first side of printing → baking board → second side of printing → baking board ten, character purpose: character is a kind of marking process that is easy to identify: after the end of green oil → cooling and standing → adjusting the net →Printed characters→Back 11, gold-plated fingers Purpose: Plating a layer of nickel/gold layer with a required thickness on the plug finger to make it more rigid and wear-resistant. Process: upper plate → degreasing → water washing twice → Micro-etching→washing twice→acid washing→copper plating→water washing→nickel plating→water washing→gold-plated tinplate (a process of juxtaposition) Purpose: Spray tin is sprayed on the bare copper surface not covered with solder resist oil Lead-tin is used to protect the copper surface from oxidation and oxidation to ensure good solderability. Process: micro-etching→air drying→preheating→rosin coating→solder coating→hot air leveling→air cooling→washing and drying 12, molding purpose: the method of shape forming required by customers by die stamping or numerical control machine, beer board, handcuffs, hand-cutting instructions: the accuracy of the data board and the board is higher, the handcuffs are second, the hand cutting board can only do some simple shapes. Thirteen, the purpose of the test: through the electronic 100% test, the detection of open circuit, short circuit, etc., which are not easily found by visual observation, affect the functional defects. Process: upper mold → release board → test → qualified → FQC visual inspection → unqualified → repair → return test → OK → REJ → scrapped fourteen, final inspection purpose: through 100% visual inspection of the appearance defects of the board, and minor defects Repairs are made to avoid problems and defective boards flowing out. Specific work flow: incoming materials → view data → visual inspection → qualified → FQA random inspection → qualified → packaging → unqualified → processing → check OK