PCB soldering of PCB manufacturers

Pcb manufacturing wave soldering principle

Wave soldering process and equipment wave soldering was first invented by Fry's Metal Company of the United Kingdom in the 1950s. It is the most mature, most influential and most efficient result of the 20th century electronic pcb manufacturing product assembly process technology. It is still the mainstream of PCB manufacturing assembly process.

The principle of wave soldering is to form a molten solder of a specific shape on the liquid surface of the solder bath by the action of the molten liquid solder. The PCB with the components inserted and mounted is placed on the transmission chain at a certain angle and certain immersion depth passes through the solder peaks, and the process of making solder joints for PCB manufacturing is also called group welding or flow soldering. The wave soldering method is mainly used in the traditional through-hole insertion process, as well as the surface-assembly and through-hole inserted components. The surface mounted components suitable for wave soldering are rectangular and cylindrical chip components,such as SOT and smaller SOP device, etc.

Main factors affecting PCB soldering temperature

In the wave soldering process,the heating temperature is as important as the cleanliness of the metal surface to be soldered during the pcb soldering process. The main influencing factors of the solder joint during the heating process are the temperature of the heat source, the heat capacity and thermal conductivity of the soldered components and parts, that is, the heat dissipation effect of the soldered components and parts on the solder joints; in addition, the activation and heating flux, heating and melting the solder and the heat are necessary to ensure good pcb soldering. These requirements for temperature must be balanced with the heat that the welding equipment can provide.