Prototype pcb manufacturing defect analysis and solutions

1. PCB deformation is greatly, bending

Causes analysis of defects

A. High preheating temperature

B. Long time pass tin

C. The temperature of the tin pot is high

D. The cooling rate is not suitable, the PCB does not cool after the wave soldering, or the method of quenching

2. Copper foil lifted off

A. PCB quality problems, poor PCB processing, extremely vulnerable

B. The temperature of the tin pot is too high

C. Long time pass tin

3. There is a residue on the PCB.

A. The flux amount is large, the flux volatilization is insufficient, and the surface of the PCB has flux residue.

B. There are many tin slag in the tin pot and there are residues on the PCB.

C. The temperature of the tin pot is low, and the PCB is damaged by copper for a long time high temperature.

D. The preheating temperature is low, and the PCB is damaged by copper for a long time high temperature.

E. The board speed is too fast, and the PCB is damaged by copper for a long time high temperature.

Due to the complexity of the wave soldering process, a defect in prototype pcb manufacturing is often the result of multiple causes, and one cause can also cause multiple defects. Therefore, when analyzing the defects of prototype pcb manufacturing,we should be considered from multiple angles and aspects.