Prototype pcb panel design requirements

In order to make full use of the substrate and improve the placement efficiency, multiple small printed boards with the same or different graphics can be used to form the panel. When the size of the prototype PCB is smaller than the minimum mounting size (<50mmx50mm), the panel method must be used, and the special-shaped board also needs to be jointed.

1.Panel design requirements

(1) The size of the panel should not be too large or too small. It should be convenient to process and not cause large deformation during manufacturing, assembly and testing. And determined according to the thickness of the prototype PCB (1mm thickness of the largest PCB size is 200mmx150mm).

(2) The clamping side of the panel is generally 10mm, the side with positioning holes is 8 ~ 10mm, and the side without positioning holes is 3mm.

(3) Mark points are added to the opposite corners of each small plate

(4) Positioning holes are added to the process side, and the distance is 5mm on each side.

(5) If the double-sided mounting is not used for wave soldering, you can use double-sided panel, half of the front and back (yin and yang board)

(6) Interconnection between prototype PCB panel: There are three types of interconnection methods between the small PCBs panel, double-sided engraved V-grooves and stamping board. It require both a certain mechanical strength and easy separation after assembly.

2,Layout requirements for panel components

In the pcb design, the arrangement of the components should avoid the damage caused by the split stress. Generally, the stress during the split of the panel is near the split hole of the broken label or stamp board. Therefore, the layout of the components of the panel should be followed; Do not place valuable components and key components in large locations; Chip components near the broken sign should be placed parallel to the broken sign, avoiding being placed directly with the broken sign. If it must be placed vertically, it should be far away from the broken sign with a large divisional stress. The minimum distance between the component and the broken edge is 5mm.