date：2019-10-16 17:23:19
Rigid flex pcb manufacturers main items and methods of incoming inspection
The materials before the SMT assembly mainly include components, PCB, solder paste flux and other assembly process materials. The basic contents of rigid flex pcb manufacturers are component solderability, pin coplanarity, usage performance, PCB size and appearance, solder mask quality, warpage and distortion, solderability, solder mask integrity. The metal percentage, viscosity, powder oxidation amount of the solder paste, the amount of metal contamination of the solder, the activity and concentration of the flux, and the viscosity of the binder. Rigid flex pcb manufacturers have different detection methods for different inspection items.
Main items and basic testing methods for incoming inspection before assembly
|
Incoming category |
Inspection items |
Inspection methods |
|
|
Components |
Solderability |
Wetting balance test Impregnation test Solder ball test |
|
|
· Lead coplanarity
|
Optical plane detection Mounter coplanarity test |
||
|
Using performance |
Sampling-special instrument testing |
||
|
PCB |
Size and appearance inspection |
visual inspection |
|
|
Quality of solder mask |
Special measuring tool |
||
|
Warping and twisting |
Thermal stress test |
||
|
Solderability |
Rotary immersion test Wave solder immersion test Solder bead test |
||
|
Welding resistance film integrity |
Thermal stress test |
||
|
Process material |
Solder paste |
Appearance, printing performance check |
Visual inspection, printing performance test |
|
Viscosity and thixotropic coefficient |
Rotary viscosizer |
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|
Wettability, solder ball |
Reflow soldering |
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|
Metal percentage |
Heating separation weighing method |
||
|
Alloy powder oxidation average |
Auger analysis |
||
|
Flux |
Activation |
Bronze mirror experiment |
|
|
Concentration |
Areometer |
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|
Deterioration |
Visual color |
||
|
Bonder |
Viscosity and thixotropic coefficient |
Rotary viscosizer |
|
|
Bonding strength |
Bonding strength test |
||
|
Curing time |
Curing experiment |
||
|
Cleaning agent |
Composition |
Gas packet analysis |
|
|
solder alloy |
Contamination of metal |
Atomic adsorption test |
|
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