SMT components disassemble tips

It's not easy to remove the SMT components in one minute. You need to practice more often to get more experience so that you can quickly and easily disassemble the components without damage. Following reminder only for your reference:

1. For surface mount components with fewer pins, such as resistors, capacitors, diodes, and triodes, first place tin on one of the PCB pads,then use the left hand to secure the component to the mounting position with the tweezers and then solder the pins with the right hand soldering iron. The remaining pins are soldered by tin wires. It is also easy to disassemble these components by simply soldering the ends of the assembly with a soldering iron and carefully removing the tin after it has melted.

2. The soldering method is the same as the above for the components with many SMD pins and wide components. Removal of such components is generally more suitable for use with a heat gun. A hand-held heat gun melts the solder and uses the other hand to remove the component using tweezers or other clamps.

3.FASTPCBA SMT Processing For surface mount components with relatively high pin densities, the soldering process is similar, that is, soldering one pin first, then soldering the remaining pins with tin. When the pin number is dense, the alignment of the pins and pins is a key factor. High-density latches parts are removed using a heat gun. Use tweezers to clamp the components, blow back all the pins with a heat gun, and then remove the components as they melt. If you still need to disassemble the components, try not to blow the component center as fast as possible. After removing the components, clean the pads with a soldering iron.