SMT production line, also called Surface Mount Technology, is a new generation of electronic assembly technology developed from hybrid integrated circuit technology. It is characterized by the use of component surface mount technology and reflow soldering technology, and has become a new generation of assembly technology in electronic product manufacturing. . The main equipment of SMT production line includes: printing machine, placement machine (electronic components on the upper surface), reflow soldering, plug-in, wave furnace, test packaging. The wide application of SMT promotes the miniaturization and multi-functionalization of electronic products, and provides conditions for mass production and low defect rate production. SMT is surface assembly technology, a new generation of electronic assembly technology developed from hybrid integrated circuit technology.

With the development of IC packaging in the direction of high integration, high performance, multi-lead and narrow pitch, it promotes the wide application of SMT technology in high-end electronic products, but due to the limitation of process capability, it faces many technical difficulties. After 1998, BGA devices began to be widely used, especially in the communications manufacturing industry. The application proportion of BGA devices showed a rapid growth. At the same time, SMT technology, driven by high-end products such as communications, entered a period of rapid and good development. .

Electronic products have shown a trend of miniaturization and multifunctionalization. The market for consumer electronic products represented by mobile phones and speakers has shown explosive growth, which has further promoted the miniaturization of surface mount components and the high level of product assembly. Density, small and fine-pitch devices such as 0201 components, CSPs, and flipchips have also entered the practical application of SMT, which has greatly improved the application level of SMT technology and also increased the process difficulty.