SMT manufacturing advantages

(1) High assembly density

SMT manufacturing surface mount components are much smaller than traditional through-hole components. In general, the surface assembly technology can reduce the size of electronic products by about 60% and reduce the weight by about 80%. If a high-level integrated circuit package such as a chip-scale package is used, the area can be greatly reduced. If the components are assembled by through-hole insertion technology, the components are arranged according to the 2.54mm grid, and the components are assembled by surface assembly technology. The grid of component layout has been developed from 1.27mm to 0.4mm grid, and some even reach 0.35mm grid mounted component has a higher density.

(2) High reliability

Due to the high reliability of the surface-assembled components and the small and light components, the seismic resistance performance is strong and the automated production level is high. Usually the solder joint rate is less than one part per million, which is one magnitude lower than the traditional through-hole soldering technology-wave soldering. The average none failures time between smt assembly electronic products is 250,000 hours. Currently, almost 90% of electronic products SMT manufacturing adopts SMT process

(3) Good high frequency characteristics

Since the chip components are firmly mounted, the devices are usually pin less or short leads, which reduces the effects of parasitic inductance and parasitic capacitance and improves the high frequency characteristics of the circuit. Circuits designed with surface mount technology have a maximum frequency of 3 GHz, while circuits with through-hole components are designed for a maximum frequency of only 500 MHz. SMT can also reduce the delay time and can be used for circuits with a clock frequency of 16 MHz or higher. If you use Multi-Chip Module (MCM) technology, the high-end clock frequency of the computer workstation can reach 100MHz, and the additional power consumption caused by parasitic reactance can be reduced by 2~3 times.

(4) Cost reduction

Since the printed circuit board used in SMT does not require large-area drilling on the surface of the printed circuit board, the number of drilled holes on the printed circuit board is reduced, and the SMT manufacturing problem is greatly reduced, saving the cost of repair: simultaneously improving the circuit frequency characteristics reduce the cost of circuit debugging; and because the chip components are small in size and light in weight, the packaging, transportation and storage costs are reduced, and more importantly, the chip components are rapidly developed, and the price is relatively cheap compared to the components of the DIP package.

(5) Facilitate automated production

At present, the through-hole printed circuit board should be fully automated, and the original printed circuit board area should be increased by 40%, so that the insertion head of the automatic plug-in can insert components, and if the insertion hole does not have enough space,which will damage the components. The automatic placement machine adopts a vacuum nozzle to absorb and suck, discharge components, and the vacuum nozzle is smaller than the shape of the component, which can increase the installation density. In fact, small components and fine pitch QFP components can be produced by using an automatic placement machine. Achieve fully automated production.