Soft board FPCB material characteristics
date：2018-11-05 15:52:00
Soft board FPCB material characteristics
The product characteristics of the soft board FPCB, in addition to the soft material, is actually light in texture and extremely thin in configuration? Extremely light structure, the material can be flexed many times without the fracture condition of the rigid PCB insulation material, and the soft plastic substrate and the wire layout of the soft board make the soft board unable to cope with the excessive conduction current. , voltage, so in the high-power electronic circuit applications, almost no soft pcb board design, but in small current, low-power consumer electronics, the use of soft boards is quite large.
Because the cost of the flexible board is still affected by the key material PI and the unit cost is high, when designing the product, the soft board is usually not used as the main carrier board, but the key design requiring "soft" characteristics is applied locally. For example, the soft board application of the electronic zoom lens of the digital camera or the soft board material of the electronic circuit of the optical head of the optical disc drive is required to move the electronic component or the functional module, and the hard circuit board material cannot be matched. In the case, an example of designing a soft board circuit is adopted.
Used in aerospace and military applications in the early days. Today, it is shining in consumer electronics applications.
In the 1960s, the use of soft boards was quite common. At that time, the price of soft board products was high. Although it was light, flexible, and thin, the unit cost was still high. It was only used for high-tech, aerospace, military. There are many uses. In the late 1990s, soft boards began to be used in large quantities in consumer electronics applications. Before and after 2000, the production of flexible circuit boards was mostly in the United States and Japan, mainly due to the soft board materials under the control of major suppliers in the United States and Japan, plus materials. Restrictions make the cost of flexible boards high.
PI is also called "polyamidamine". In PI, it can be divided into various structures such as wholly aromatic PI and semi-aromatic PI due to its heat resistance and molecular structure. The wholly aromatic PI is a linear type. There are substances that are not melted and not melted and thermoplastic. The properties of the non-melting material cannot be shot and formed during production, but the material can be compressed and sintered, and the other can be produced by injection molding.
Semi-aromatic PI, which is a kind of material in Polyetherimide, Polyetherimide is generally thermoplastic and can be produced by injection molding. As for the thermosetting PI, different material properties, it can be laminated, impregnated, or transferred by impregnation.
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