Structural design reduces stress on board deformation
date：2018-11-08 11:32:00
Structural design reduces stress on board deformation
1. Enhance the material rigidity of the structure to prevent the board from being deformed
For example, changing the original plastic case material to a metal case to enhance its ability to resist external impact, or to increase the ribs without changing the case material. The force surface strengthens its ability to resist stress deformation.
In addition, some people use a one-piece shield to cover the BGA parts that are prone to solder cracking to enhance the strength of the part. The shield must also be extracted with a rigid material to form a perfect bowl.
However, Shenzhen Honglijie does not recommend such a design, because the one-piece shield is very unfavorable for the maintenance of the circuit board, and a large part of it relies on the strength of the solder. Once the solder of the shield can not be stressed, it cracks. It will crack all the way to the BGA's solder ball.
2. Through the structural design to resist the easy deformation of the circuit board to reduce the amount of deformation
Shenzhen Honglijie shared a case before, using the front and rear casings to grow a column to withstand the circuit board, to reduce the impact of the impact of the product when the product fell from the height of the impact.
This case was very successful. Later, there were other cases to imitate, but because there was no extra space on the board and the column was placed on a shield, the result was of course unsatisfactory, because the shield was hollow and could not be used at all, can reduce the plate bend.
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