Incoming material inspection before SMT assembly is not only the basis for ensuring the quality of the SMT assembly process, but also the basis for ensuring the reliability of SMA products. Only qualified raw materials can have qualified products. Therefore, the incoming inspection of SMT patch processing is to ensure the reliability of SMA. Important link. With the continuous development of SMT patch technology and the continuous improvement of SMA assembly density, performance and reliability requirements, as well as the further miniaturization of components and the acceleration of technological material application updates, SMA products and their patch processing and assembly The sensitivity and dependence of quality on the quality of assembly materials are increasing, and incoming inspection before assembly becomes an increasingly important link. The selection of scientific and applicable standards and methods for rice inspection before assembly has become one of the main contents of assembly quality inspection in SMT processing plants.

The main content and methods of incoming material inspection before assembly. The incoming materials before the assembly of SMT chip processing plants mainly include components, PCB, solder paste/flux and other assembly process materials. The basic content of the inspection includes the solderability of components, pin coplanarity, performance, PCB size and appearance, solder mask quality, warpage and distortion, solderability, solder mask integrity, solder paste Metal percentage, viscosity, average amount of powder oxidation, metal contamination of solder, flux activity and concentration, adhesive viscosity, etc. Corresponding to different inspection items, there are many inspection methods. For example, there are many methods such as immersion test, solder ball test, wetting balance test, etc. for solderability test of components.