Why does the pcb supplier choose no-clean soldering process?

With the protection of the atmospheric ozone layer, the in-depth development of Ozone Depleting Substances (ODS) and the rapid development of SMT, more and more pcb suppliers are choosing or preparing to use no-clean soldering technology, low solid content and no-wash. No-clean soldering technology for flux has been rapidly applied. The no-clean soldering process refers to the using of low-solids, non-corrosive flux in the electronic assembly process, soldering in an inert gas environment, and the residue on the printed circuit board after soldering is extremely less, non-corrosive, and extremely high. Surface Insulation Resistance (SIR), which is generally required to achieve ion cleanliness without cleaning, and can directly enter the process technology of the next process.

“Absolute cleaning” and “not cleaning” are two completely different concepts. “Not cleaning” refers to the using of traditional weakly activated rosin flux (RMA) or organic acid flux in the electronic assembly process. There is a certain amount of residue on the surface, but it can meet the quality requirements of some products without cleaning. For example, household electronic products are usually “not cleaned” in production, but not “free-clean”.

1. The superiority of free-clean welding

Improve economic efficiency. After the no-cleaning, the most direct benefit is that the pcb supplier does not have to be cleaned, so it can save a lot of cleaning labor, equipment, site, materials (water, solvent) and energy consumption, and saves time due to shortened process flow, improving production efficiency.

2) Improve the quality of pcb supplier products. Due to the no-clean process, it is required to strictly control the quality of the material, such as the corrosion resistance of the flux (no halides are allowed), the solderability of the components and the printed circuit board. In the assembly process, some advanced processes, such as spraying flux, welding under inert gas protection, etc., are required. The no-clean process avoids damage to the soldered components caused by cleaning stress and is therefore highly beneficial for improving product quality.

3) Conducive to environmental protection. The using of no-clean technology can stop the using of ozone layer substances, and also greatly reduce the using of volatile organic compounds (VOC), which has a positive effect on the protection of the ozone layer.