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: 94v0 FR4 High TG Circuit Board Multilayer HDI Pcb

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[Posts]Production process and control of high multilayer circuit board2020/10/19/ 15:41: Abstract: This article analyzes the main manufacturing difficulties of the high multilayer circuit board, such as the degree of alignment between layers, the production of inner layers, the production of laminating, and the production of drilling.; Read（0） Label：

[Company News]What is Flexible Printed Circuit (with process flow)2020/09/24/ 17:15: Flexible Printed Circuit (FPC) It is made of conductive circuit patterns by using light imaging pattern transfer and etching process on the surface of a flexible substrate. The surface and inner layers of double-sided and multilayer circuit boards are metalized The hole realizes the electrical connection between the inner and outer layers, and the surface of the circuit pattern is protected and insulated by PI and the glue layer.; Read（0） Label：

[Posts]Reliability of multilayer circuit boards2020/09/07/ 16:28: Due to the use of new production materials, the volume of the multilayer circuit board is small and the weight is relatively light. Most importantly, the connection lines of the internal components are also greatly reduced.; Read（0） Label：

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