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- [Posts]Production process and control of high multilayer circuit board2020/10/19/ 15:41
- Abstract: This article analyzes the main manufacturing difficulties of the high multilayer circuit board, such as the degree of alignment between layers, the production of inner layers, the production of laminating, and the production of drilling.
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- [Company News]FR4 board PCB multilayer board lamination process2019/07/12/ 17:33
- The parameters such as the total thickness and number of layers of the PCB laminate are limited by the characteristics of the PCB. Special plates generally have a limited variety of plates of different thicknesses, so designers must cons...
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- [Company News]Multilayer Printed Circuit Board (Multilayer Printed-wiring Board)2019/05/06/ 15:58
- Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) : Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bond...
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