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[Company News]Prototype pcb manufacturing BGA package category and process characteristics2019/10/25/ 16:06: The BGA package is available in PBGA, TBGA, CBGA, FBGA and other categories. PBGA and CBGA will undergo "dynamic deformation" during welding due to the different layered structure of the package and the coefficient of thermal expansion (CTE) of each layer of material. That is, Deformation will occur with increasing temperature during the re-flow soldering of prototype pcb manufacturing due to warping.; Read（0） Label：Prototype pcb manufacturing| BGA package| pcb manufacturing| pcb board| pcb prototype| pcb order

[Company News]How to set smt soldering circuit board welding temperature profile?2019/10/14/ 20:56: For smt soldering circuit board lead or lead-free process, why should there be a 11 ° C-12 ° C overheating? There are two reasons, one is to ensure that the BGA package completes the second collapse......; Read（0） Label：smt soldering circuit board| smt soldering| pcb manufacturing| pcb manufacturer| pcb factory

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