Product parameters:

Product Category: Military High Frequency Board PCB
Product model: FASTA01PA-02
Plate used: Taiguang (EM-825)
Number of floors: 8 floors
Minimum line width/line spacing: 0.3mil /0.3mil
Maximum size: 610mmX1200mm
Thickness: 0.3-3.5mm

Surface technology: tin spray, lead-free tin spray, immersion gold, full board gold plating, plug gold plating, chemical immersion tin (silver), anti-oxidation (OSP) blue glue, carbon oil

The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (εr) of the materials used.

FASTPCBA provides you with know-how, all popular materials and qualified manufacturing processes - reliably even for complex requirements.