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- [Company News]BGA rework process2019/12/07/ 10:21
- Since the solder joint of the BGA is at the bottom of the device, it is invisible, so it is more difficult to rework compared to QFP and other peripheral pins. It is not a big problem when disassembling the BGA. However, when re-soldering the BGA, the rework system is required to be equipped with a spectroscopic vision system (also known as the bottom reflection optical system) to ensure accurate centering when mounting the BGA. The equipment suitable for rework BGA includes hot air rework station, infrared heating rework station, hot air Infrared rework system, etc.
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