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Surface mount component package category
The package structure of SMD components is the basis of process design. According to the structure of pins or solder joints, it can be divided into: Chip type J-shaped pin type, L-shaped pin type, BGA type, BTC type, castle type.more +
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- [Company News]SMC/SMID components (SsD) transportation, storage and use requirements2019/11/18/ 11:38
- Unsuitable storage conditions can cause component quality to deteriorate, resulting in poor solderability. The storage conditions of SMD components must be standardized.
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- [Company News]Pcb manufacturing company wave soldering joint requirements2019/10/25/ 15:54
- The requirements for soldering solder joints of pcb manufacturing companies are shown in Table 12-1 below.
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