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- [Company News]Prototype pcb panel design requirements2019/12/03/ 15:49
- In order to make full use of the substrate and improve the placement efficiency, multiple small printed boards with the same or different graphics can be used to form the panel. When the size of the prototype PCB is smaller than the minimum mounting size (<50mmx50mm), the panel method must be used, and the special-shaped board also needs to be jointed.
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- [Company News]In PCB manufacturing,component layout direction of wave soldering process2019/12/03/ 15:38
- In order to make both ends of the PCB manufacturing components contact the solder wave at the same time, the long axis of the chip component should be perpendicular to the direction of the wave soldering machine.
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- [Company News]Wave soldering flux coating, welding temperature and time requirements2019/12/02/ 15:21
- There are many process parameters of wave soldering, mainly including flux coating amount, printed board preheating temperature and time, welding temperature and time, printed board climbing angle and wave height, conveyor speed, cooling rate, etc. These parameters affect each other and are quite complicated, so the comprehensive adjustment of process parameters is also very important.
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- [Company News]Solder Paste Collapse Cause Analysis2019/11/28/ 16:27
- Collapse is divided into cold collapse and hot collapse. Cold collapse refers to the collapse behavior that occurs at room temperature. After printing, the solder paste gradually diffuses under the surrounding environmental conditions, and the solder paste coating gradually changes from a well-shaped brick to a smooth dome shape.
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- [Company News]Im-Sn plating2019/11/27/ 14:56
- Im-Sn is the abbreviation of Immersion Tin, commonly known as immersion tin and melting tin.
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- [Company News]QFN packaging and process features2019/11/26/ 17:57
- QFN packaging and process features QFN is the most widely used BTC. At first it was only used for products with low reliability requirements but price sensitivity. Due to its excellent high-frequency performance, it is increasingly used in...
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- [Company News]PCB manufacturing solder paste storage and application2019/11/25/ 09:10
- Solder paste is the most important process material, and It’s a very important process operation for solder paste’s storage, thawing, stirring and addition .
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- [Company News]Cleaning agent in PCB manufacturing2019/11/21/ 16:26
- The cleaning agent is mainly used for post-weld cleaning of assembled boards, to remove flux residues after reflow, wave soldering and manual soldering, as well as contaminants caused during the assembly process.
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- [Company News]In PCB manufacturing, wave soldering machines development direction and requirements2019/11/19/ 13:54
- It is widely used in PCB manufacturing wave soldering and mixing process, especially in electronic products.
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- [Company News]Solder paste printing principle2019/11/15/ 11:06
- Solder paste printing is the first step in the SMT assembly process, and its function is to distribute solder paste. Solder paste printing process is the core process of SMT, which determines the process quality of SMT.
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- [Company News]PCB manufacturing reliability definition2019/11/12/ 11:05
- Although there is a consensus that reliability is an important attribute of PCB manufacturing products, the definition of reliability and the more popular ones are as follows:
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- [Company News]PCB manufacturer's advice on controlling tin whisker growth2019/11/06/ 16:05
- At present, the most common method for inhibiting the growth of tin whiskers by PCB manufacturers is to plate the Sn layer with Ni and heat it at 150 ° C for 1~2 h for annealing to maintain the proper size of the tin grains to reduce tin fluidity in the grain boundaries of the material.
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- [Company News]Prototype pcb manufacturing good joints mechanical properties2019/11/06/ 15:55
- The four most important characteristics of the prototype pcb manufacturing joint are: shear strength, creep, isothermal fatigue and thermomechanical fatigue. By combining the meanings of these four characteristics, a complete performance information of the solder joint can be obtained.
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- [Company News]PCB manufacturing solder paste printing common defects and solutions2019/11/05/ 16:01
- By controlling the various links of the pcb manufacturing printing process, various defects often appear in printing can be prevented. The following is a brief description of several common defects and solutions for solder paste printing.
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- [Company News]PCB fabrication reflow process advantages2019/11/05/ 15:37
- Choosing the right pcb fabrication welding process has a large impact on the quality of the solder joints after assembly. Which process is selected is mainly based on the assembly density of PCB printed circuit boards and SMT production line equipment conditions.
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- [Company News]Pcb supplier reflow solder ball generation cause and solution2019/11/04/ 15:45
- In pcb supplier circuit board manufacturing, the generation of solder balls is closely linked to the soldering process of solder joints. If the gas in the solder joint does not escape in time, it may cause voiding.
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- [Company News]Prototype pcb manufacturing BGA package category and process characteristics2019/10/25/ 16:06
- The BGA package is available in PBGA, TBGA, CBGA, FBGA and other categories. PBGA and CBGA will undergo "dynamic deformation" during welding due to the different layered structure of the package and the coefficient of thermal expansion (CTE) of each layer of material. That is, Deformation will occur with increasing temperature during the re-flow soldering of prototype pcb manufacturing due to warping.
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- [Company News]PCB manufacturing lead-free flux main problems and countermeasures2019/10/21/ 15:58
- Lead-free solder pastes and wave soldered water soluble fluxes are also required for certain pcb manufacturing products.
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- [Company News]PCB supplier solder paste selection principle2019/10/19/ 16:16
- The pcb supplier should generally select solder paste in accordance with the specific production environment, with reference to the activity, viscosity, powder shape, particle size and melting point of the solder paste.
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- [Company News]Pcb manufacturer how to control lead-free wave soldering process2019/09/12/ 10:46
- The pcb manufacturer quality control method of wave soldering is basically the same as reflow soldering in principle, because their soldering mechanism and RC28F128K3C solder joint quality requirements are the same.
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