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- [Posts]Preparation work before PCBA soldering2021/09/24/ 16:59
- PCBA welding involves many PCBA processing links, and the quality of PCBA welding is closely related to these links. PCBA electronics manufacturers must ensure that every link is done well in order to provide customers with high-quality PCBA services. Today, FASTPCBA will analyze with you what preparations the factory has to do before wave soldering?
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- [Posts]What is half hole printed circuit board?2021/09/01/ 18:10
- A half hole printed circuit board refers to a hole (drill, gong groove) that is drilled and shaped, and then half of the metalized hole (groove) is retained. In order to control the production of metal half-hole plates, some measures are usually taken due to process problems at the intersection of metallized half-holes and non-metallized holes.
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- [Company News]The shortage of chips spreads across the world, and the demand for PCBs for automobiles increases greatly2021/03/02/ 18:01
- According to industry insiders, the recent significant increase in orders received by automotive PCB manufacturers is mainly due to the fact that PCB factories are currently driven by the strong demand from the IT and communications industries, and the production capacity of high-end processes is tight. Tier1 automotive electronics factory considers the lessons of the lack of chips and accelerates. Single car board, ready for quick production after the chip problem is solved.
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- [Company News]Common detection methods for PCB boards2020/10/08/ 16:36
- In order to ensure the production quality of PCB boards, the manufacturer has gone through a variety of inspection methods during the production process. Each inspection method will target different PCB board defects. I will briefly introduce you below.
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- [Company News]Why say FASTPCBA is a responsible pcb manufacturer?2020/04/20/ 14:38
- FASTPCBA's service-oriented, customer-oriented attitude, treat any customer is the same. Our development benefits from quality-oriented and better customer service, we will adhere to the original intention in order to do better.
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- [Company News]In PCB manufacturing，flux quality and selection2019/12/18/ 16:49
- The flux is the key material in solder paste for purifying the soldering surface of PCB manufacturing, improving the wettability, preventing solder oxidation, and ensuring the quality and excellent process of the solder paste. During the heating process, the flux affects the PCB pads, component terminals, and the oxide layer on the surface of the lead which function as cleaning. At the same time, it activates the metal surface.
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- [Company News]Mounting machine failure analysis and troubleshooting2019/12/13/ 14:15
- Whether the placement machine operate normal or not directly affects the placement quality and PCB manufacturing output. In order to run normally of machine, it is necessary to fully understand the structure and characteristics of the machine, to grasp the manifestations of the machine prone to various failures, the causes of failures, and the troubleshooting methods. Only by timely discovering the problem, finding out the cause, correcting and solving the problem in a timely manner, can the machine exert its proper placement efficiency.
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- [Company News]In PCB manufacturing dispensing common defects and solutions2019/12/09/ 15:10
- Some drip coating defects often occur in PCB manufacturing, such as wire drawing / tailing, discontinuities in glue dot size, no glue dots, and satellite dots.
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- [Company News]Prototype pcb panel design requirements2019/12/03/ 15:49
- In order to make full use of the substrate and improve the placement efficiency, multiple small printed boards with the same or different graphics can be used to form the panel. When the size of the prototype PCB is smaller than the minimum mounting size (<50mmx50mm), the panel method must be used, and the special-shaped board also needs to be jointed.
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- [Company News]In PCB manufacturing,component layout direction of wave soldering process2019/12/03/ 15:38
- In order to make both ends of the PCB manufacturing components contact the solder wave at the same time, the long axis of the chip component should be perpendicular to the direction of the wave soldering machine.
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- [Company News]SMC/SMID components (SsD) transportation, storage and use requirements2019/11/18/ 11:38
- Unsuitable storage conditions can cause component quality to deteriorate, resulting in poor solderability. The storage conditions of SMD components must be standardized.
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- [Company News]Surface assembly process design principles2019/11/16/ 11:27
- Typical surface assembly methods include full surface assembly, single-sided mixing, and double-sided mixing. Full surface assembly means that both sides of the PCB are mounted components (SMC/SMD); single-sided mixing means that both the SMC/SMD and the through-hole components(THC) are on the PCB, and the THC is in the main Face, SMC/SMD may be on the main side or on the auxiliary side; double-sided mixing means that both sides have SMC/SMD, THC is on the main side, and there may be THC on both sides.
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- [Company News]Flux behavior in wave soldering2019/11/13/ 16:19
- During wave soldering, the flux will partially evaporate during the preheating phase, cleaning the surface to be soldered, leaving a rosin film, functions as partially separating the air and preventing oxidation.
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- [Company News]Selective wave soldering advantage2019/11/11/ 15:20
- Selective wave soldering is a special form of wave soldering invented to meet the requirements of modern welding processes. It also has three main components of flux unit, preheating unit and welding unit. Through pre-programmed procedures, the machine can be sprayed and welded in a targeted manner. The welding efficiency and reliability are higher than manual welding, and the welding cost is lower than wave soldering.
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- [Company News]PCB manufacturer's advice on controlling tin whisker growth2019/11/06/ 16:05
- At present, the most common method for inhibiting the growth of tin whiskers by PCB manufacturers is to plate the Sn layer with Ni and heat it at 150 ° C for 1~2 h for annealing to maintain the proper size of the tin grains to reduce tin fluidity in the grain boundaries of the material.
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- [Company News]PCB manufacturing solder paste printing common defects and solutions2019/11/05/ 16:01
- By controlling the various links of the pcb manufacturing printing process, various defects often appear in printing can be prevented. The following is a brief description of several common defects and solutions for solder paste printing.
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- [Company News]SMT manufacturing advantages2019/10/31/ 18:09
- SMT manufacturing surface mount components are much smaller than traditional through-hole components. In general, the surface assembly technology can reduce the size of electronic products by about 60% and reduce the weight by about 80%.
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- [Company News]PCB manufacturing companies clean - free flux requirements2019/10/30/ 17:40
- In order to make the soldered PCB meet the specified quality requirements without cleaning, the selection of flux is the key. PCB manufacturing companies usually have the following requirements for the solders without cleaning
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- [Company News]Prototype pcb manufacturing BGA package category and process characteristics2019/10/25/ 16:06
- The BGA package is available in PBGA, TBGA, CBGA, FBGA and other categories. PBGA and CBGA will undergo "dynamic deformation" during welding due to the different layered structure of the package and the coefficient of thermal expansion (CTE) of each layer of material. That is, Deformation will occur with increasing temperature during the re-flow soldering of prototype pcb manufacturing due to warping.
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- [Company News]Surface mount technology requirement for adhesive glue2019/10/19/ 17:47
- In order to ensure the reliability of surface assembly, the adhesive glue should meet the following requirements.
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