Home
FASTPCBA
PCB Board
PCB Assembly
News
QuoteSearch Products
Search News
- [Company News]PCB manufacturing reflow soldering furnace technical indicators and development direction2019/12/04/ 13:40
- The main technical indicators of PCB manufacturing reflow furnace are temperature control accuracy, lateral temperature difference of conveyor belt, maximum heating temperature, number and length of heating zones, conveyor belt width, cooling efficiency, etc
- Read（0）
- [Company News]Prototype pcb panel design requirements2019/12/03/ 15:49
- In order to make full use of the substrate and improve the placement efficiency, multiple small printed boards with the same or different graphics can be used to form the panel. When the size of the prototype PCB is smaller than the minimum mounting size (<50mmx50mm), the panel method must be used, and the special-shaped board also needs to be jointed.
- Read（0）
- [Company News]In PCB manufacturing,component layout direction of wave soldering process2019/12/03/ 15:38
- In order to make both ends of the PCB manufacturing components contact the solder wave at the same time, the long axis of the chip component should be perpendicular to the direction of the wave soldering machine.
- Read（0）
- [Company News]Wave soldering flux coating, welding temperature and time requirements2019/12/02/ 15:21
- There are many process parameters of wave soldering, mainly including flux coating amount, printed board preheating temperature and time, welding temperature and time, printed board climbing angle and wave height, conveyor speed, cooling rate, etc. These parameters affect each other and are quite complicated, so the comprehensive adjustment of process parameters is also very important.
- Read（0）
- [Company News]Im-Sn plating2019/11/27/ 14:56
- Im-Sn is the abbreviation of Immersion Tin, commonly known as immersion tin and melting tin.
- Read（0）
- [Company News]QFN packaging and process features2019/11/26/ 17:57
- QFN packaging and process features QFN is the most widely used BTC. At first it was only used for products with low reliability requirements but price sensitivity. Due to its excellent high-frequency performance, it is increasingly used in...
- Read（0）
- [Company News]PCB manufacturing solder paste storage and application2019/11/25/ 09:10
- Solder paste is the most important process material, and It’s a very important process operation for solder paste’s storage, thawing, stirring and addition .
- Read（0）
- [Company News]Cleaning agent in PCB manufacturing2019/11/21/ 16:26
- The cleaning agent is mainly used for post-weld cleaning of assembled boards, to remove flux residues after reflow, wave soldering and manual soldering, as well as contaminants caused during the assembly process.
- Read（0）
- [Company News]Solder paste printing principle2019/11/15/ 11:06
- Solder paste printing is the first step in the SMT assembly process, and its function is to distribute solder paste. Solder paste printing process is the core process of SMT, which determines the process quality of SMT.
- Read（0）
- [Company News]PCB manufacturing reliability definition2019/11/12/ 11:05
- Although there is a consensus that reliability is an important attribute of PCB manufacturing products, the definition of reliability and the more popular ones are as follows:
- Read（0）
- [Company News]PCB manufacturing reflow soldering process requirements2019/11/11/ 15:08
- Reflow soldering is a key process for PCB manufacturing SMT and must be carried out under controlled conditions. The process requirements for reflow soldering are as follows.
- Read（0）
- [Company News]Pcb manufacturing affecting solder paste printing factors2019/11/08/ 11:35
- The factors that pcb manufacturing affects solder paste printing include three aspects, namely solder paste performance, stencil and printing process.
- Read（0）
- [Company News]Printed circuit board reliability affecting factor2019/11/07/ 15:34
- Printed circuit board reliability depends on three aspects: 1. Design - poor design buried inherent reliability issues; 2. Manufacturing - solder joint integrity and microstructure (influencing factors during manufacturing); 3. Use - application environmental stress (deterioration factor in use)
- Read（0）
- [Company News]PCB manufacturer's advice on controlling tin whisker growth2019/11/06/ 16:05
- At present, the most common method for inhibiting the growth of tin whiskers by PCB manufacturers is to plate the Sn layer with Ni and heat it at 150 ° C for 1~2 h for annealing to maintain the proper size of the tin grains to reduce tin fluidity in the grain boundaries of the material.
- Read（0）
- [Company News]Prototype pcb manufacturing good joints mechanical properties2019/11/06/ 15:55
- The four most important characteristics of the prototype pcb manufacturing joint are: shear strength, creep, isothermal fatigue and thermomechanical fatigue. By combining the meanings of these four characteristics, a complete performance information of the solder joint can be obtained.
- Read（0）
- [Company News]PCB manufacturing solder paste printing common defects and solutions2019/11/05/ 16:01
- By controlling the various links of the pcb manufacturing printing process, various defects often appear in printing can be prevented. The following is a brief description of several common defects and solutions for solder paste printing.
- Read（0）
- [Company News]PCB fabrication reflow process advantages2019/11/05/ 15:37
- Choosing the right pcb fabrication welding process has a large impact on the quality of the solder joints after assembly. Which process is selected is mainly based on the assembly density of PCB printed circuit boards and SMT production line equipment conditions.
- Read（0）
- [Company News]Pcb supplier reflow solder ball generation cause and solution2019/11/04/ 15:45
- In pcb supplier circuit board manufacturing, the generation of solder balls is closely linked to the soldering process of solder joints. If the gas in the solder joint does not escape in time, it may cause voiding.
- Read（0）
- [Company News]Prototype pcb manufacturing, how to control PCB and components before wave soldering?2019/11/02/ 11:30
- For printed circuit boards that have been placed for a long time, the surface is generally cleaned, which improves the solderability of prototype pcb manufacturing, reduces virtual soldering and bridging. For component leads that have a certain degree of oxidation on the surface, the surface oxide should be removed firstly.
- Read（0）
- [Company News]Online pcb manufacturing welding requirements for production process materials2019/11/01/ 16:26
- Online pcb manufacturing welding requirements for production process materials
- Read（0）
Relevant Search
Spotlight
What is difference between PCB and PCBA?
- we know that PCBA gene...
- 1What is circuit board design for manufacturability?
- 253rd Earth Day on April 22, 2022
- 3What are the classifications of dry film photoresists in pcba circuit boards?
- 4What is Halogen Free PCB Board?
- 5How to solve the problem of chip components standing up during SMT assembly?
- 6What are the standards for SMT and DIP assembly of components?
- 7Advantages and disadvantages of PCB flying probe testing
- 82022 Tomb Sweeping Day Holiday
- 9What is MCPCB?
- 10How to distinguish the number of pcb layers?
Building 1, Senyang Electronic Technology Park, Guangming High-tech Park, Yutang Street, Guangming District, Shenzhen City.
F:86-13418481618
pcba13@fastpcba.cn
