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- [Company News]PCB manufacturing reflow furnace equipment maintenance2019/12/10/ 14:11
- 1.Routine maintenance measures for reflow furnaces ① Keep the equipment clean and clean it once a week. ② Clean the flux recovery system regularly (lead-free residue is more). ③ Regularly check the operation of equipment chains, racks, motors, fans, etc.
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- [Company News]BGA rework process2019/12/07/ 10:21
- Since the solder joint of the BGA is at the bottom of the device, it is invisible, so it is more difficult to rework compared to QFP and other peripheral pins. It is not a big problem when disassembling the BGA. However, when re-soldering the BGA, the rework system is required to be equipped with a spectroscopic vision system (also known as the bottom reflection optical system) to ensure accurate centering when mounting the BGA. The equipment suitable for rework BGA includes hot air rework station, infrared heating rework station, hot air Infrared rework system, etc.
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- [Company News]0201, 01005 Printing and mounting Technology2019/12/06/ 13:59
- 0201, 01005 solder paste printing accuracy directly affects the quality of reflow soldering. Therefore, it is necessary to correctly design PCB pads, correctly design and process stencils, equip with high-precision printing machines, optimize printing process parameters, and perform 100% 3D SPI inspections.
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- [Company News]PCB manufacturing solder joint strength and connection reliability analysis2019/12/06/ 10:44
- The strength and connection reliability of Pcb welding joints are related to the metallographic structure of the solder joint and the thickness of the bonding layer.
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- [Company News]PCB manufacturing reflow soldering furnace technical indicators and development direction2019/12/04/ 13:40
- The main technical indicators of PCB manufacturing reflow furnace are temperature control accuracy, lateral temperature difference of conveyor belt, maximum heating temperature, number and length of heating zones, conveyor belt width, cooling efficiency, etc
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- [Company News]Prototype pcb panel design requirements2019/12/03/ 15:49
- In order to make full use of the substrate and improve the placement efficiency, multiple small printed boards with the same or different graphics can be used to form the panel. When the size of the prototype PCB is smaller than the minimum mounting size (<50mmx50mm), the panel method must be used, and the special-shaped board also needs to be jointed.
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- [Company News]In PCB manufacturing,component layout direction of wave soldering process2019/12/03/ 15:38
- In order to make both ends of the PCB manufacturing components contact the solder wave at the same time, the long axis of the chip component should be perpendicular to the direction of the wave soldering machine.
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- [Company News]Wave soldering flux coating, welding temperature and time requirements2019/12/02/ 15:21
- There are many process parameters of wave soldering, mainly including flux coating amount, printed board preheating temperature and time, welding temperature and time, printed board climbing angle and wave height, conveyor speed, cooling rate, etc. These parameters affect each other and are quite complicated, so the comprehensive adjustment of process parameters is also very important.
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- [Company News]Im-Sn plating2019/11/27/ 14:56
- Im-Sn is the abbreviation of Immersion Tin, commonly known as immersion tin and melting tin.
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- [Company News]QFN packaging and process features2019/11/26/ 17:57
- QFN packaging and process features QFN is the most widely used BTC. At first it was only used for products with low reliability requirements but price sensitivity. Due to its excellent high-frequency performance, it is increasingly used in...
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- [Company News]PCB manufacturing solder paste storage and application2019/11/25/ 09:10
- Solder paste is the most important process material, and It’s a very important process operation for solder paste’s storage, thawing, stirring and addition .
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- [Company News]Cleaning agent in PCB manufacturing2019/11/21/ 16:26
- The cleaning agent is mainly used for post-weld cleaning of assembled boards, to remove flux residues after reflow, wave soldering and manual soldering, as well as contaminants caused during the assembly process.
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- [Company News]Solder paste printing principle2019/11/15/ 11:06
- Solder paste printing is the first step in the SMT assembly process, and its function is to distribute solder paste. Solder paste printing process is the core process of SMT, which determines the process quality of SMT.
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- [Company News]PCB manufacturing reliability definition2019/11/12/ 11:05
- Although there is a consensus that reliability is an important attribute of PCB manufacturing products, the definition of reliability and the more popular ones are as follows:
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- [Company News]PCB manufacturing reflow soldering process requirements2019/11/11/ 15:08
- Reflow soldering is a key process for PCB manufacturing SMT and must be carried out under controlled conditions. The process requirements for reflow soldering are as follows.
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- [Company News]Pcb manufacturing affecting solder paste printing factors2019/11/08/ 11:35
- The factors that pcb manufacturing affects solder paste printing include three aspects, namely solder paste performance, stencil and printing process.
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- [Company News]Printed circuit board reliability affecting factor2019/11/07/ 15:34
- Printed circuit board reliability depends on three aspects: 1. Design - poor design buried inherent reliability issues; 2. Manufacturing - solder joint integrity and microstructure (influencing factors during manufacturing); 3. Use - application environmental stress (deterioration factor in use)
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- [Company News]PCB manufacturer's advice on controlling tin whisker growth2019/11/06/ 16:05
- At present, the most common method for inhibiting the growth of tin whiskers by PCB manufacturers is to plate the Sn layer with Ni and heat it at 150 ° C for 1~2 h for annealing to maintain the proper size of the tin grains to reduce tin fluidity in the grain boundaries of the material.
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- [Company News]Prototype pcb manufacturing good joints mechanical properties2019/11/06/ 15:55
- The four most important characteristics of the prototype pcb manufacturing joint are: shear strength, creep, isothermal fatigue and thermomechanical fatigue. By combining the meanings of these four characteristics, a complete performance information of the solder joint can be obtained.
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- [Company News]PCB manufacturing solder paste printing common defects and solutions2019/11/05/ 16:01
- By controlling the various links of the pcb manufacturing printing process, various defects often appear in printing can be prevented. The following is a brief description of several common defects and solutions for solder paste printing.
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