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- [Company News]Pcb manufacturing affecting solder paste printing factors2019/11/08/ 11:35
- The factors that pcb manufacturing affects solder paste printing include three aspects, namely solder paste performance, stencil and printing process.
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- [Company News]Printed circuit board reliability affecting factor2019/11/07/ 15:34
- Printed circuit board reliability depends on three aspects: 1. Design - poor design buried inherent reliability issues; 2. Manufacturing - solder joint integrity and microstructure (influencing factors during manufacturing); 3. Use - application environmental stress (deterioration factor in use)
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- [Company News]PCB manufacturer's advice on controlling tin whisker growth2019/11/06/ 16:05
- At present, the most common method for inhibiting the growth of tin whiskers by PCB manufacturers is to plate the Sn layer with Ni and heat it at 150 ° C for 1~2 h for annealing to maintain the proper size of the tin grains to reduce tin fluidity in the grain boundaries of the material.
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- [Company News]Prototype pcb manufacturing good joints mechanical properties2019/11/06/ 15:55
- The four most important characteristics of the prototype pcb manufacturing joint are: shear strength, creep, isothermal fatigue and thermomechanical fatigue. By combining the meanings of these four characteristics, a complete performance information of the solder joint can be obtained.
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- [Company News]PCB manufacturing solder paste printing common defects and solutions2019/11/05/ 16:01
- By controlling the various links of the pcb manufacturing printing process, various defects often appear in printing can be prevented. The following is a brief description of several common defects and solutions for solder paste printing.
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- [Company News]PCB fabrication reflow process advantages2019/11/05/ 15:37
- Choosing the right pcb fabrication welding process has a large impact on the quality of the solder joints after assembly. Which process is selected is mainly based on the assembly density of PCB printed circuit boards and SMT production line equipment conditions.
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- [Company News]Pcb supplier reflow solder ball generation cause and solution2019/11/04/ 15:45
- In pcb supplier circuit board manufacturing, the generation of solder balls is closely linked to the soldering process of solder joints. If the gas in the solder joint does not escape in time, it may cause voiding.
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- [Company News]Prototype pcb manufacturing, how to control PCB and components before wave soldering?2019/11/02/ 11:30
- For printed circuit boards that have been placed for a long time, the surface is generally cleaned, which improves the solderability of prototype pcb manufacturing, reduces virtual soldering and bridging. For component leads that have a certain degree of oxidation on the surface, the surface oxide should be removed firstly.
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- [Company News]Online pcb manufacturing welding requirements for production process materials2019/11/01/ 16:26
- Online pcb manufacturing welding requirements for production process materials
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- [Company News]PCB manufacturing companies clean - free flux requirements2019/10/30/ 17:40
- In order to make the soldered PCB meet the specified quality requirements without cleaning, the selection of flux is the key. PCB manufacturing companies usually have the following requirements for the solders without cleaning
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- [Company News]Printed circuit board manufacturers reflow soldering poor wetting solution2019/10/28/ 10:33
- The welding quality of components' solder joints is a key factor that directly affects the quality of printed circuit components and even the whole machine
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- [Company News]Prototype pcb manufacturing BGA package category and process characteristics2019/10/25/ 16:06
- The BGA package is available in PBGA, TBGA, CBGA, FBGA and other categories. PBGA and CBGA will undergo "dynamic deformation" during welding due to the different layered structure of the package and the coefficient of thermal expansion (CTE) of each layer of material. That is, Deformation will occur with increasing temperature during the re-flow soldering of prototype pcb manufacturing due to warping.
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- [Company News]Pcb manufacturing company wave soldering joint requirements2019/10/25/ 15:54
- The requirements for soldering solder joints of pcb manufacturing companies are shown in Table 12-1 below.
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- [Company News]Prototype pcb manufacturing solder joint formation process and influencing factors2019/10/24/ 16:08
- The prototype pcb manufacturing electronic product is soldered by heating and flux applications to activate the flux, remove the oxide film on the surface to be soldered, liquefy the solder and complete the wetting and diffusion process to form solder joints. Specifically, the formation of solder joints involves two processes:
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- [Company News]Prototype pcb manufacturing complete solder joint requirements2019/10/23/ 14:36
- Prototype pcb manufacturing complete solder joint requirements are introduced in the article
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- [Company News]PCB manufacturing lead-free flux main problems and countermeasures2019/10/21/ 15:58
- Lead-free solder pastes and wave soldered water soluble fluxes are also required for certain pcb manufacturing products.
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- [Company News]How does pcb board manufacturer protect against static electricity?2019/10/18/ 16:40
- PCB board manufacturer regularly check tools with anti-static requirements to keep them in a qualified state; test environmental parameters such as humidity, temperature, concentration, static point position, etc.; test the electrostatic sensitivity of the product and establish a quality analysis and feedback system.
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- [Company News]Prototype pcb manufacturing defect analysis and solutions2019/10/17/ 21:29
- Prototype pcb manufacturing defect analysis and solutions 1. PCB deformation is greatly, bending Causes analysis of defects A. High preheating temperature B. Long time pass tin C. The temperature of the tin pot is high D. The cooling rate ...
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- [Company News]Prototype pcb failure cause analysis (2)2019/09/22/ 00:01
- As the hub of various components and circuit signal transmission, prototype PCB has become the most important and key part of electronic information products.Which quality and reliability determine the quality and reliability of the whole equipment.
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- [Company News]Pcb manufacturer how to control lead-free wave soldering process2019/09/12/ 10:46
- The pcb manufacturer quality control method of wave soldering is basically the same as reflow soldering in principle, because their soldering mechanism and RC28F128K3C solder joint quality requirements are the same.
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