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- [Company News]Surface assembly process design principles2019/11/16/ 11:27
- Typical surface assembly methods include full surface assembly, single-sided mixing, and double-sided mixing. Full surface assembly means that both sides of the PCB are mounted components (SMC/SMD); single-sided mixing means that both the SMC/SMD and the through-hole components(THC) are on the PCB, and the THC is in the main Face, SMC/SMD may be on the main side or on the auxiliary side; double-sided mixing means that both sides have SMC/SMD, THC is on the main side, and there may be THC on both sides.
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- [Company News]Solder paste printing principle2019/11/15/ 11:06
- Solder paste printing is the first step in the SMT assembly process, and its function is to distribute solder paste. Solder paste printing process is the core process of SMT, which determines the process quality of SMT.
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- [Company News]Wave soldering process parameter setting requirements2019/11/14/ 11:26
- Frequently debugging wave soldering process parameters include component surface preheating temperature, soldering surface preheating temperature, soldering temperature, contact time (also called soldering time)
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- [Company News]Selective wave soldering advantage2019/11/11/ 15:20
- Selective wave soldering is a special form of wave soldering invented to meet the requirements of modern welding processes. It also has three main components of flux unit, preheating unit and welding unit. Through pre-programmed procedures, the machine can be sprayed and welded in a targeted manner. The welding efficiency and reliability are higher than manual welding, and the welding cost is lower than wave soldering.
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- [Company News]SMD adhesive composition, storage and use process requirements2019/11/09/ 11:16
- The SMD adhesive is usually composed of a matrix resin, a curing agent, and a curing accelerator, a toughening agent, a filler etc.
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- [Company News]PCB manufacturing solder paste printing common defects and solutions2019/11/05/ 16:01
- By controlling the various links of the pcb manufacturing printing process, various defects often appear in printing can be prevented. The following is a brief description of several common defects and solutions for solder paste printing.
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- [Company News]PCB fabrication reflow process advantages2019/11/05/ 15:37
- Choosing the right pcb fabrication welding process has a large impact on the quality of the solder joints after assembly. Which process is selected is mainly based on the assembly density of PCB printed circuit boards and SMT production line equipment conditions.
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- [Company News]Pcb supplier reflow solder ball generation cause and solution2019/11/04/ 15:45
- In pcb supplier circuit board manufacturing, the generation of solder balls is closely linked to the soldering process of solder joints. If the gas in the solder joint does not escape in time, it may cause voiding.
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- [Company News]Electronic circuit board manufacturng 5s management2019/11/02/ 11:44
- 5s management is the basis of on-site management. The 5s management originated in Japan and refers to the effective management of production factors such as personnel, machines, materials and methods at the production site. This is a unique management method for Japanese companies. Since Seiri, Seiton, Seiso, Seiketsu, and Shitsuke are the first letters of the Japanese alphabet, the first letter of the Roman alphabet is "S", so it is simply referred to as 5s.
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- [Company News]Prototype pcb manufacturing, how to control PCB and components before wave soldering?2019/11/02/ 11:30
- For printed circuit boards that have been placed for a long time, the surface is generally cleaned, which improves the solderability of prototype pcb manufacturing, reduces virtual soldering and bridging. For component leads that have a certain degree of oxidation on the surface, the surface oxide should be removed firstly.
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- [Company News]Online pcb manufacturing welding requirements for production process materials2019/11/01/ 16:26
- Online pcb manufacturing welding requirements for production process materials
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- [Company News]PCB manufacturing companies clean - free flux requirements2019/10/30/ 17:40
- In order to make the soldered PCB meet the specified quality requirements without cleaning, the selection of flux is the key. PCB manufacturing companies usually have the following requirements for the solders without cleaning
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- [Company News]PCB manufacturing solder paste printing quality control2019/10/30/ 17:20
- The entire pcb manufacturing printing process can be subdivided into: clamping alignment, tin filling, flattening and release. The following describes the various processes of solder paste printing and their control points.
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- [Company News]Green custom pcb board pcb manufacturing2019/10/29/ 15:06
- Material selection in green custom pcb board manufacturing There are many types of materials in electronic products, such as conductive materials, semiconductor materials, and insulating materials. The green nature of the material has a very important impact on that of the product, and we should be especially pay attention when selecting
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- [Company News]Modern electric circuit board components packaging development2019/10/29/ 14:48
- The electric circuit board products are developing towards portable, miniaturized, networked and multimedia. This market demand puts forward corresponding requirements for circuit assembly technology.
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- [Company News]Printed circuit board manufacturers reflow soldering poor wetting solution2019/10/28/ 10:33
- The welding quality of components' solder joints is a key factor that directly affects the quality of printed circuit components and even the whole machine
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- [Company News]SMT PCB assembly process improvement inspection methods2019/10/28/ 10:15
- The goal of quality management is not to put the defective smt pcb assembly printed circuit board on the production line back process, set up special testing equipment after the manufacturing station, and timely detect, find and correct the defects.
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- [Company News]Prototype pcb manufacturing BGA package category and process characteristics2019/10/25/ 16:06
- The BGA package is available in PBGA, TBGA, CBGA, FBGA and other categories. PBGA and CBGA will undergo "dynamic deformation" during welding due to the different layered structure of the package and the coefficient of thermal expansion (CTE) of each layer of material. That is, Deformation will occur with increasing temperature during the re-flow soldering of prototype pcb manufacturing due to warping.
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- [Company News]Pcb manufacturing company wave soldering joint requirements2019/10/25/ 15:54
- The requirements for soldering solder joints of pcb manufacturing companies are shown in Table 12-1 below.
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- [Company News]Quick turn pcb fabrication affecting solderability factors2019/10/24/ 16:28
- There are many factors that affect the solderability of components or pcb fabrication pads, mainly including:
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