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- [Company News]PQFN printing, mounting and rework process2019/12/11/ 11:58
- The assembly process of PQFN (Plastic Quad Flat No-lead) is similar to BGA. CSP, because there is a large thermal pad on the bottom of the device, and the bottom electrode does not have the buffer function of the solder ball, so the coplanarity requirements are stricter. So it’s more difficult to assemble it than CSP
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- [Company News]FPC application and development2019/12/11/ 11:47
- FPC (Flexible Printed Circuit) also known as soft printed circuit board, flex pcb, referred to as flexible pcb. FPC is made of polyimide or polyester film as a substrate with highly reliable flexible printed circuit board.
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- [Company News]Through Hole Reflow Process (PIHR) introduction2019/12/10/ 14:19
- Through-hole component reflow soldering process (Pin-In-Hole Reflow, PIHR) is to insert pins into the insertion hole filled with solder paste and use the reflow soldering process method to achieve through-hole components and surfaces mount components (SMC / SMD) are reflowed at the same time. Compared with traditional crafts, it has great advantages in economy and advancedness.
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- [Company News]PCB manufacturing reflow furnace equipment maintenance2019/12/10/ 14:11
- 1.Routine maintenance measures for reflow furnaces ① Keep the equipment clean and clean it once a week. ② Clean the flux recovery system regularly (lead-free residue is more). ③ Regularly check the operation of equipment chains, racks, motors, fans, etc.
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- [Company News]In PCB manufacturing dispensing common defects and solutions2019/12/09/ 15:10
- Some drip coating defects often occur in PCB manufacturing, such as wire drawing / tailing, discontinuities in glue dot size, no glue dots, and satellite dots.
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- [Company News]How to choose electronic components2019/12/09/ 15:01
- The selection of components should be based on the circuit requirements of the specific product, as well as the size of the PCB, the density and type of the assembly, the grade of the product and the cost of the input.
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- [Company News]BGA rework process2019/12/07/ 10:21
- Since the solder joint of the BGA is at the bottom of the device, it is invisible, so it is more difficult to rework compared to QFP and other peripheral pins. It is not a big problem when disassembling the BGA. However, when re-soldering the BGA, the rework system is required to be equipped with a spectroscopic vision system (also known as the bottom reflection optical system) to ensure accurate centering when mounting the BGA. The equipment suitable for rework BGA includes hot air rework station, infrared heating rework station, hot air Infrared rework system, etc.
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- [Company News]0201, 01005 Printing and mounting Technology2019/12/06/ 13:59
- 0201, 01005 solder paste printing accuracy directly affects the quality of reflow soldering. Therefore, it is necessary to correctly design PCB pads, correctly design and process stencils, equip with high-precision printing machines, optimize printing process parameters, and perform 100% 3D SPI inspections.
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- [Company News]PCB manufacturing solder joint strength and connection reliability analysis2019/12/06/ 10:44
- The strength and connection reliability of Pcb welding joints are related to the metallographic structure of the solder joint and the thickness of the bonding layer.
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- [Company News]Soldering iron tips correct selection and maintenance2019/12/05/ 10:55
- The correct choice of the flame iron head can achieve better welding at the lowest temperature, and maximize the service life of the iron head. The main reasons for PCB manufacturers to choose flame iron heads are as follows. Select the proper shape of the soldering iron tip according to the type of the component to be soldered. For example: when disassembling SOIC, a two-piece flat-shovel horseshoe-shaped iron head should be selected, and when removing QFP / PLCC, a square-shaped soldering iron head should be selected. Select a soldering iron tip of appropriate size according to the size of the solder joints of the component being welded, for example: a small solder joint can use a conical grid iron
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- [Company News]PCB manufacturing reflow soldering furnace technical indicators and development direction2019/12/04/ 13:40
- The main technical indicators of PCB manufacturing reflow furnace are temperature control accuracy, lateral temperature difference of conveyor belt, maximum heating temperature, number and length of heating zones, conveyor belt width, cooling efficiency, etc
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- [Company News]Prototype pcb panel design requirements2019/12/03/ 15:49
- In order to make full use of the substrate and improve the placement efficiency, multiple small printed boards with the same or different graphics can be used to form the panel. When the size of the prototype PCB is smaller than the minimum mounting size (<50mmx50mm), the panel method must be used, and the special-shaped board also needs to be jointed.
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- [Company News]In PCB manufacturing,component layout direction of wave soldering process2019/12/03/ 15:38
- In order to make both ends of the PCB manufacturing components contact the solder wave at the same time, the long axis of the chip component should be perpendicular to the direction of the wave soldering machine.
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- [Company News]Wave soldering flux coating, welding temperature and time requirements2019/12/02/ 15:21
- There are many process parameters of wave soldering, mainly including flux coating amount, printed board preheating temperature and time, welding temperature and time, printed board climbing angle and wave height, conveyor speed, cooling rate, etc. These parameters affect each other and are quite complicated, so the comprehensive adjustment of process parameters is also very important.
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- [Company News]Solder Paste Collapse Cause Analysis2019/11/28/ 16:27
- Collapse is divided into cold collapse and hot collapse. Cold collapse refers to the collapse behavior that occurs at room temperature. After printing, the solder paste gradually diffuses under the surrounding environmental conditions, and the solder paste coating gradually changes from a well-shaped brick to a smooth dome shape.
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- [Company News]Im-Sn plating2019/11/27/ 14:56
- Im-Sn is the abbreviation of Immersion Tin, commonly known as immersion tin and melting tin.
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- [Company News]QFN packaging and process features2019/11/26/ 17:57
- QFN packaging and process features QFN is the most widely used BTC. At first it was only used for products with low reliability requirements but price sensitivity. Due to its excellent high-frequency performance, it is increasingly used in...
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- [Company News]PCB manufacturing solder paste storage and application2019/11/25/ 09:10
- Solder paste is the most important process material, and It’s a very important process operation for solder paste’s storage, thawing, stirring and addition .
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- [Company News]Cleaning agent in PCB manufacturing2019/11/21/ 16:26
- The cleaning agent is mainly used for post-weld cleaning of assembled boards, to remove flux residues after reflow, wave soldering and manual soldering, as well as contaminants caused during the assembly process.
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- [Company News]SMC/SMID components (SsD) transportation, storage and use requirements2019/11/18/ 11:38
- Unsuitable storage conditions can cause component quality to deteriorate, resulting in poor solderability. The storage conditions of SMD components must be standardized.
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